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我国首颗0.13微米TD-SCDMA3G手机芯片诞生

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作者：时间：2005-10-11 来源：

重庆市政府新闻办和重庆邮电学院宣布由重庆重邮信科股份有限公司开发出的具有我国自主知识产权的“通心一号”芯片在重庆开发暂时亮相。

　　这是世界上第一颗0.13微米工艺的TD-SCDMA 3G手机核心机待芯片。标志着我国3G通信核心芯片的关键技术达到了世界领先水平。

本文引用地址：https://www.eepw.com.cn/article/9005.htm

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关键词： 通心一号

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