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Injection molding an IC into a connector or consumable item

作者:时间:2010-08-17来源:网络收藏

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本文引用地址:http://www.eepw.com.cn/article/169232.htm

is the method of choice to embed integrated circuits (s) in medical senss d s. This application note discusses the special care required when selecting the plastic material. It explains that the processing temperature must be low enough not to soften or liquefy the solder that attaches the to a substrate. The article also discusses various plastic materials d shows how they are not all equally suited for the sterilization required by medical applications. Only few of the sterilization methods are compatible to both the plastic material and ICs. An example of an IC embedded a is shown.

Introduction

Integrated circuits (ICs) have been embedded in medical sensors and consumables or cables for quite some time. The concept and benefits of this technique are well understood.1 However, very few companies have acquired the expertise for both the manufacturing process and selecting suitable plastics for the application. This document describes the injection process in general, explains the critical temperatures, and gives an introduction to identifying suitable plastic materials.

What is injection molding?

molding is a process that forces molten plastic through a nozzle a mold cavity. The mold cavity can initially be empty or contain an object to be encased by the plastic. Figure 1 shows a simplified drawing of an injection molding machine.2 The plastic is fed into the machine as granules. A screw-type plunger transports the granules through a heated barrel towards the nozzle. Along the barrel there are typically three heating zones called rear, center, and front. The front zone, next to the nozzle, is the hottest. On the way to the nozzle the plastic granules soften and become a homogenous mass, which is forced under high pressure into the mold cavity, where it quickly cools and hardens. The mold is then opened to remove the molded object and to prepare the mold for the next cycle. The processing conditions specification in the data sheet for the plastic material lists the appropriate temperatures of the zones and the mold.

Figure 1. The principle of an injection molding machine.
Figure 1. The principle of an injection molding machine.

The critical temperature

Besides pressure and filling speed, temperature is a critical parameter in the injection molding process. Temperature is also critical for the object to be encased. An IC by itself can handle up to 300°C for a short time without any harm. This temperature is permissible if the IC to be encased is wired-bonded to a substrate (circuit board) or if it is a plastic-packaged IC with crimped-on pins or in an SFN package3 with exposed contact areas. However, if the IC is soldered to a circuit board, the critical temperature for injection molding depends on whether the IC assembly is lead (Pb)-free or not. Lead-free ICs (plastic packaged or bumped die, also known as flip chip, UCSP, or WLP) require lead-free solder, which has a melting temperature of approximately 217°C. Traditional plastic-packaged ICs and RoHS-compliant bumped dies require standard solder (Sn/Pb 63/37), which has a melting temperature of approximately 183°C. The melting temperature must not be confused with the reflow oven temperature setting, which is 235°C for lead-free and 215°C for standard products.

Finding the right plastic

With roughly 30,000 different materials available for injection molding,4 finding the right plastic may appear like a serious challenge. The task becomes easier with some insight into the characteristics of various plastic materials.5

There are thermosetting plastics, which can be heated and run through an injection molding machine just once. Epoxy, a plastic commonly used for IC packages, falls into this category. Once processed, the thermosetting plastic remains solid, regardless of the temperature. There are thermoplastics, which soften whenever they are heated. Thermoplastics can have an amorphous or semi-crystalline structure, which affects mechanical stability, chemical/wear resistance6, 7 and suitability to sterilization methods. Table 1 shows a selection of plastic materials for injection molding.

Table 1. Typical plastics for injection molding

NameFull NameCostStructureFront Zone Temp. (°C)Mold Temperature (°C)Sterilization Compatibility7, 8, 9, 10
ABSAcrylonitrile butadiene styreneLowAmorphous210 to 23263 to 85
49 to 85
ETO CD RAD
HDPEHigh-density polyethyleneLowSemi-crystalline199 to 227
171 to 199
21 to 66
21 to 52
ETO CD (rad)
LDPELow-density polyethyleneLowSemi-crystalline199 to 22721 to 66ETO CD (rad)
PANylon 6/6MediumSemi-crystalline282 to 293
249 to 271
66 to 107AUT ETO CD VHP
PBTPolybutylene terephthalateMediumSemi-crystalline243 to 257
216 to 232
66 to 121AUT ETO RAD
PCPolycarbonateMediumAmorphous293 to 310
216 to 232
82 to 121
66 to 121
AUT ETO (rad)
PETPolyethylene terephthalateMediumSemi-crystalline238 to 260135 to 163AUT ETO RAD
PMMAAcrylicLowAmorphous188 to 210
221 to 238
79 to 107
38 to 66
ETO CD VHP
POMAcetalMediumSemi-crystalline188 to 210
177 to 199
82 to 121AUT ETO
PPPolypropyleneLowSemi-crystalline204 to 227
177 to 193
32 to 66AUT ETO CD VHP
PSPolystyreneLowAmorphous221 to 238
204 to 221
38 to 66ETO CD VHP RAD
SANStyrene acrylonitrileLowAmorphous243 to 260
210 to 232
52 to 82
38 to 79

Legend:
AUT: material is well suited for autoclave sterilization.
ET material is well suited for etylene oxide sterilization.
CD: material is well suited for chlorine dioxide sterilization.
VHP: material is well suited for vaporized hydrogen peroxide sterilization.
RAD: material is well suited for gamma ray or electron beam sterilization.
(rad): material may change its characteristics, e.g., discolor, when exposed to gamma rays or electron beams.

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