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通富微电测试技术

作者:时间:2022-04-18来源:通富微电收藏

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本文引用地址:http://www.eepw.com.cn/article/202204/433191.htm

Production Overview

        TFME offers various WBBGA and WBLGA package based on customer different requirement.




Features
- 1.1x0.7 mm to 21x21 mm Package
- 0.2mm to 1.0mm C Mold Chase
- 01005 Components SMT
- 0.3x0.3 mm Small Die 
- 1-6 Layer Substrate


Process Capability & Design Rule


Reliability Test Standards



Shipment Packing









关键词: 封装 测试 通富微电

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